Ceramic POL converter package is lighter (estimate for package at right is 23g)
Entire device passes all MIL-PRF-38534 Class K screening and qualification requirements and utilizes all mil-spec components
Compliant to EEE-INST-002 derating requirements
DLA, Aerospace Corporation, Intersil, JEDEC and Micropac are working together to incorporate this design concept into the military standards
Mounting provisions
Thermal management
Pinout / pins / pads / etc.
One-third to one-half the weight of a metal package
Slightly smaller
Better thermal characteristics
Mechanical interconnect not as robust as a metal package
Overall |
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Isolated converter to eliminate intermediate stage power architecture |
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Electrical |
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VIN = 5VDC ± 10% |
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VOUT = 3.3VDC or 5VDC @ 4A |
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Efficiency target of mid 70% |
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Ripple, step response, input noise, etc are TBD |
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Radiation Environment |
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TID 100k rad(Si) – HDR and/or LDR? |
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SEL/SEB up to 60 MeV/mg/cm2 |
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SET redundancy |
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Mechanical |
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SWP – TBD |
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Thru-hole? SMD? |
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Pinout considerations? |
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Thermal – Heatsink? Mounting? Operating temperature range |
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Quality |
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DLA or MIL-PRF-38534 qualification is not required |