DC - DC POL Converter

Micropac is proposing a lightweight converter based upon a design concept proposed by our partner, Intersil


Packaging Concepts

We are evaluating a classic metal package approach vs innovative ceramic open package architecture.

  • Ceramic POL converter package is lighter (estimate for package at right is 23g)

  • Entire device passes all MIL-PRF-38534 Class K screening and qualification requirements and utilizes all mil-spec components

  • Compliant to EEE-INST-002 derating requirements

  • DLA, Aerospace Corporation, Intersil, JEDEC and Micropac are working together to incorporate this design concept into the military standards

Mechanical considerations

  • Mounting provisions

  • Thermal management

  • Pinout / pins / pads / etc.

Ceramic package tradeoff

  • One-third to one-half the weight of a metal package

  • Slightly smaller

  • Better thermal characteristics

  • Mechanical interconnect not as robust as a metal package


General Requirements

Isolated converter to eliminate intermediate stage power architecture
VIN = 5VDC ± 10%
VOUT = 3.3VDC or 5VDC @ 4A
Efficiency target of mid 70%
Ripple, step response, input noise, etc are TBD
Radiation Environment
TID 100k rad(Si) – HDR and/or LDR?
SEL/SEB up to 60 MeV/mg/cm2
SET redundancy
Thru-hole? SMD?
Pinout considerations?
Thermal – Heatsink? Mounting? Operating temperature range
DLA or MIL-PRF-38534 qualification is not required